AHL-HP90 Laser scribing machine
Scribing and cutting metal materials, germanium, gallium arsenide and other semi-conductor substrate materials and processing solar cell board, silico n chips, potsherd and aluminum foil.
Laser slicer is also known as ceramic laser cutter or laser scriber. It takes continuous bump acoustics-optics regulation Q Nd:YAG laser reactor as operation light resource. The two-dimensional worktable controlled by the computer can make all kinds of movement according to input figures. It has high output power, high scribing precision and high speed. It can cut curve or straight line figures and has no pollution, low noise. The perform ance is steady and reliable.
Laser slicer is also known as ceramic laser cutter or laser scriber. It takes continuous bump acoustics-optics regulation Q Nd:YAG laser reactor as operation light resource. The two-dimensional worktable controlled by the computer can make all kinds of movement according to input figures. It has high output power, high scribing precision and high speed. It can cut curve or straight line figures and has no pollution, low noise. The perform ance is steady and reliable.
Sample
Technical parameters
Laser: YAG Infrared laser, or Green laser
Worktable: AUTO XY axis
Moving precision: 0.03mm
Line scribing/cutting speed: 10-100mm/s
Line scribing/cutting width: 0.03mm-0.1mm
Line scribing depth: 0.001mm-0.5mm
Min. Displacement: 0.01 mm
Electrical source: 220VAC¡À10% 50Hz
Working environment :Clean,no shaking,Temperature 13 ¡æ -28 ¡æ, humidity 5% -75%
Worktable: AUTO XY axis
Moving precision: 0.03mm
Line scribing/cutting speed: 10-100mm/s
Line scribing/cutting width: 0.03mm-0.1mm
Line scribing depth: 0.001mm-0.5mm
Min. Displacement: 0.01 mm
Electrical source: 220VAC¡À10% 50Hz
Working environment :Clean,no shaking,Temperature 13 ¡æ -28 ¡æ, humidity 5% -75%
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